Microsoft and Corintis etched hair‑width channels into chips so liquid coolant flows directly over hot spots, cutting GPU temperature rise by 65% and removing heat up to 3x better than today’s cold plates. The AI‑optimized, leaf‑vein channel patterns work with hot‑liquid cooling (~70°C) and enabled burst overclocking on live Teams servers.
— If adopted, this design could raise server power density, change datacenter energy and heat‑reuse strategies, and accelerate the AI infrastructure build with new environmental and grid implications.
Alexander Kruel
2025.09.24
70% relevant
The roundup links Microsoft’s announcement of chip‑level microfluidic cooling that removes heat up to 3x better, enabling higher‑density AI clusters—directly matching the hardware‑cooling advance.
msmash
2025.09.23
100% relevant
“Removed heat up to three times better than cold plates… reduced maximum temperature rise by 65%… coolant effective at 70°C,” demonstrated on Microsoft Teams servers and under consideration for first‑party chips.
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