Packaging Masks Foundry Shortfalls

Intel's Xeon 6+ mixes three fabrication nodes (18A compute chiplets, Intel 3 base tiles, Intel 7 I/O tiles) and uses Foveros Direct stacking to deliver a single high‑performance server part. This shows advanced packaging can deliver performance gains even while single‑node scaling is uneven. — If packaging can substitute for monolithic node leadership, competition, investment flows, and national industrial policy (e.g., subsidies, export controls) will shift toward packaging and system integration as strategic battlegrounds.